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- T0603HI
Datasheets
Series: Thin Film SMD Chip Fuses
Thin Film HI Series
Features:
- Low DCR
- High inrush current withstanding capability
- Fiberglass enforced epoxy fuse body
- Copper termination with nickel and tin plating
- Halogen free, RoHS compliance and lead-free
Applications:
- Consumer Electronics
- Notebook computers and tablets
- Telecom Devices
- Mobile Phone
- Digital Cameras
- Battery Pack